Cu-9Ni-6Sn合金显微硬度及微观组织研究  

Study on microhardness and microstructure for Cu-9Ni-6Sn alloy

作　　者：武峥 龚留奎 赵孝孝 刘晓彬[1,2] 宋士鑫 邓立勋 黄伟 Wu Zheng;Gong Liukui;Zhao Xiaoxiao;Liu Xiaobin;Song Shixin;Deng Lixun;Huang Wei(Ningbo Branch of Chinese Academy of Ordnance Science,Ningbo 315103,China;Inner Mongolia Metal Material Research Institute,Baotou 014034,China;China North Material Science and Engineering Technology Group Co.,Ltd.,Ningbo 315103,China)

机构地区：[1]中国兵器科学研究院宁波分院,浙江宁波315103 [2]内蒙金属材料研究所,内蒙古包头014034 [3]北方材料科学与工程研究院有限公司,浙江宁波315103

出　　处：《锻压技术》2025年第4期97-106,共10页Forging & Stamping Technology

基　　金：创建国家自主创新示范区项目(XM2024XTGXQ12);宁波市重点研发计划(2023Z092,2023Z096)。

摘　　要：采用OM、SEM、EBSD、TEM及硬度计等检测手段,研究了Cu-9Ni-6Sn合金的微观组织与性能,结果表明:挤压处理后,Cu-9Ni-6Sn合金的晶粒尺寸大幅度降低,基本呈等轴晶且分布较为均匀,铸态晶界处粗大的富Sn相发生破碎并且数量有所减少,内部主要存在微米级的富Sn相和纳米级的长条状、颗粒状Ni_(x)Sn_(y)化合物。Cu-9Ni-6Sn合金较优的固溶工艺为950℃/2 h+水淬,该过程中伴随着晶界迁移和晶粒合并,晶粒长大至394.565μm,但晶界处微米级富Sn相和纳米级Ni_(x)Sn_(y)化合物基本全部回溶至基体中,只有少量颗粒状富Sn残留,整体固溶效果良好。The microstructure and properties of Cu-9Ni-6Sn alloy were studied by using the detection methods such as OM,SEM,EBSD,TEM and hardness tester.The results show that after extrusion treatment,the grain size of Cu-9Ni-6Sn alloy is greatly reduced,and it is basically equiaxed and evenly distributed.The coarse Sn-rich phase at the as-cast grain boundary is broken and the number is reduced.The interior mainly contains micro-sized Sn-rich phase,nano-sized long strip and granular Ni_(x)Sn_(y)compounds.The optimal solid solution process of Cu-9Ni-6Sn alloy is 950℃/2 h+water quenching.During this process,the grains grow to 394.565μm,accompanying grain boundary migration and grain merging.However,the micro-sized Sn-rich phase and nano-sized Ni_(x)Sn_(y)compounds at the grain boundary are basically dissolved back into the matrix,and only a small amount of granular Sn-rich phase remains.The overall solid solution effect is good.

关 键 词：Cu-9Ni-6Sn合金 显微硬度 挤压 固溶处理 晶界迁移 晶粒合并 

分 类 号：TG146.1[一般工业技术—材料科学与工程]