基于脉冲微孔喷射法的微滴按需调控及直接沉积凸点研究  

Droplet-on-demand and direct deposition of bumps based on pulsated orifice ejection method

作　　者：董伟[1] 贾赞儒 许富民[1] 王旭东[1] 赵阳 DONG Wei;JIA Zanru;XU Fumin;WANG Xudong;ZHAO Yang(School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,Liaoning,China;National Key Laboratory for Remanufacturing,Army Academy of Armored Forces,Beijing 100072,China)

机构地区：[1]大连理工大学材料科学与工程学院,辽宁大连116024 [2]陆军装甲兵学院装备再制造技术国防科技重点实验室,北京100072

出　　处：《材料工程》2025年第4期178-186,共9页Journal of Materials Engineering

基　　金：国家自然科学基金项目(51571050);国防科技重点实验室基金项目(JCKY61420052014)。

摘　　要：微滴喷射的稳定性和微滴尺寸的按需制备是实现芯片封装中凸点直接制备的重要前提。采用脉冲微孔喷射法(POEM)进行SAC305商用无铅焊料的喷射实验,探究了微滴喷射过程中,脉冲波形、传动杆与微孔的距离和微孔直径等工艺参数相互作用对喷射稳定性和粒子尺寸的影响,对制得焊球的表面及组织形貌、成分和相组成进行了分析。结果表明,通过协同关键工艺参数能够实现微滴的稳定喷射及尺寸的按需调控,目标粒径与实际尺寸偏差在4%以内,能够满足凸点制备稳定按需的前提条件。微滴凝固过程中的温度变化结果表明,氩气氛围中的冷速远低于氦气氛围,因此组织更粗大。结合上述结果,直接在纯铜板上制备凸点,形成了冶金层,表明了该技术的可行性,为凸点的直接制备提供了一种新途径。The stability of micro-droplet ejection and size on-demand are important prerequisites for the direct preparation of bumps in chip packaging.The ejection experiment of SAC305 commercial lead-free solder is carried out by pulsated orifice ejection method(POEM).The effects of the interaction of parameters such as the pulse waveform,the distance between the transmission rod and the orifice and the orifice,diameter on the ejection stability and particle size during the droplet ejection process are investigated.The surface morphology and microstructure,composition,and phase composition of the solder ball are analyzed.The results show that the stable ejection of droplets and the control of size-on-demand can be realized by coordinating the key process parameters.The deviation between the target particle size and the actual size is within 4%,which can meet the needs for the stable on-demand preparation of bumps.The results of temperature change during droplet solidification show that the cooling rate in the argon atmosphere is much lower than that in the helium atmosphere,so the microstructure is coarser.Combined with the above results,the bumps are directly deposited on the copper plate to form a metallurgical layer,which shows the feasibility of the technology and provides a new way for the direct preparation of bumps.

关 键 词：脉冲微孔喷射法 SAC305 BGA焊球 凸点制备 

分 类 号：TB34[一般工业技术—材料科学与工程]