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作 者:葛如飞 李晓明 王俐纯 冯剑锋 GE Ru-fei;LI Xiao-ming;WANG Li-chun;FENG Jian-feng(Shanghai Aerospace Electronic Technology Institute,Shanghai 201109,China)
出 处:《计算机仿真》2025年第3期36-39,308,共5页Computer Simulation
基 金:科技部“十四五”国家重点研发项目(2021YFB3900103)。
摘 要:某星载高速AD电单机由4块AD板和1块电源板组成,针对上述单机高热流密度的特点,为维持元器件性能以及可靠性要求,运用均温板技术对各PCB板进行散热模块设计,同时遵循传热最优原则,最小化各PCB板传热路径上的传热热阻,大大提高散热效率,同时对机箱外壳采用一体化设计,实现整机轻量化设计。整机热仿真分析结果显示整机温度水平大大降低。通过模拟空间环境开展地面验证试验,测试结果进一步验证了散热设计方法的合理性。A spaceborne high-speed AD electric machine consists of four AD boards and a power board.According to the characteristics of the single high heat current density,to maintain the components'performance and reliability requirements,and follow the principle of heat transfer optimal integration design of the chassis,the temperature plate technology is used for the PCB board cooling module design,improve the heat dissipation efficiency.Additionally,an integrated design approach is applied to the enclosure of the unit,achieving a lightweight design for the entire device.The thermal simulation analysis result of the whole machine shows that the temperature level of the whole machine is greatly reduced.By simulating the ground verification test,the test results further verify the rationality of the heat dissipation design method.
分 类 号:V411.8[航空宇航科学与技术—航空宇航推进理论与工程]
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