SPS工艺下Ti中间层连接SiC陶瓷的接头组织与强度研究  

Microstructure and Strength of SiC Ceramic Joints Diffusion Bonded by Sparks Plasma Sintering with the Ti Interlayer

作　　者：胡伟钦 谢悠 徐芯茹 谭瑞轩 杨腾飞 HU Weiqin;XIE You;XU Xinru;TAN Ruixuan;YANG Tengfei(School of Materials Science and Engineering,Hunan University,Changsha 410082,China)

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082

出　　处：《电焊机》2025年第4期40-48,共9页Electric Welding Machine

基　　金：国家重点研发计划(2023YFB3711100);国家磁约束核聚变能发展研究专项(2024YFE03150000)。

摘　　要：采用20μm高纯Ti膜作为中间层,常压烧结SiC陶瓷作为基材,利用放电等离子工艺(SPS)进行扩散连接。借助扫描电子显微镜、电子能谱、剪切试验、透射电子显微镜和X射线衍射仪等手段探究了不同保温时间(5 min、10 min和20 min)下SiC接头的微观组织和力学性能。研究发现,SiC接头平均剪切强度与保温时间存在一定关联,随着保温时间的延长,剪切强度呈上升趋势。保温5 min的接头平均剪切强度为51.57 MPa,保温10 min后提高至54.83 MPa,保温20 min时达到58.65 MPa。得益于牢固的界面结合,接头剪切断裂主要发生在基材。微观组织表征结果显示,SiC接头界面结合质量较高,不同保温时间的中间层结构类似,各个位置的中间层厚度均匀。接头的主要相组成为Ti3SiC2、TiC和Ti5Si3。随着保温时间的延长,Ti3SiC2与Ti5Si3相含量也增多,Ti5Si3相的增加会导致界面裂纹,而Ti3SiC2相的产生则有效提升了接头强度。In this study,the 20μm high-purity Ti films were used as the interlayer,and the pressureless-sintered SiC was used as the substrate,for joining of SiC ceramics by the spark plasma sintering.The microstructure and strength of SiC joints under different holding times were investigated by means of scanning electron microscopy,electron energy spectroscopy,shear strength tests,transmission electron microscopy,and X-ray diffractometer.Through shear tests,the shear strengths of the SiC joints bonded under different holding times were compared.There is a certain correlation between the average shear strength of the joints and the holding time.The average shear strength of the joint with a holding time of 5 min was 51.57 MPa.When the holding time was extended to 10 min,the average shear strength of the joint increased to 54.83 MPa.When the holding time was further extended to 20 min,the average shear strength of the joint reached 58.65 MPa.Benefiting from the strong interfacial bonding,the shear fracture of the joint mainly occurred in the substrate.The results of microstructure characterization showed that the interfacial bonding quality of the SiC joint was high.The structures of the interlayer under different holding times were similar,and the thickness of the interlayer at each position was uniform.The main phase components of the joint were Ti3SiC2,TiC,and Ti5Si3.With the increase of the holding time,the detected contents of Ti3SiC2 and Ti5Si3 also increased.

关 键 词：SIC陶瓷 扩散连接 Ti中间层 放电等离子烧结(SPS) 抗剪切强度 

分 类 号：TQ174[化学工程—陶瓷工业]