铜合金在增材制造领域的研究进展  

Recent Advances in Copper Alloys for Additive Manufacturing

作　　者：郑富凯 韩光达 张思雨 郭鑫辉 冯靖凯 ZHENG Fukai;HAN Guangda;ZHANG Siyu;GUO Xinhui;FENG Jingkai(Xi’an Rare Metal Materials Research Institute Co.,Ltd.,Xi'an 710000,China)

机构地区：[1]西安稀有金属材料研究院有限公司,陕西西安710000

出　　处：《铜业工程》2025年第2期110-129,共20页Copper Engineering

基　　金：陕西省自然科学基础研究青年项目(2023-JC-QN-0619)资助。

摘　　要：增材制造(AM)技术,俗称3D打印,作为一种发展中的先进制造技术,近年来在多个工业制造领域得以较大规模应用。为总结AM技术在铜合金领域的研究进展,重点梳理了铜合金产品的增材制造过程、铜合金AM制品的应用领域,以及铜合金AM产品性能的优化路径。本文通过文献调研和实例分析,提示了铜合金AM过程的特殊要求,以及影响AM质量的关键因素。此外,探讨了通过后处理技术优化铜合金AM部件性能的可能性。结果发现,铜合金的AM技术在汽车、医疗、热管理、航空航天、消费电子等领域的应用前景十分广阔,但目前仍面临加工难度大、工艺优化复杂等挑战。本综述为铜合金AM的研究和工业应用提供了一个参考框架,并指出了进一步研究的方向。Additive manufacturing(AM),commonly known as 3D printing,has revolutionized industrial production,offering unprecedented freedom and complexity in processing various materials.Copper alloys,notable for their excellent electrical and thermal conductivity as well as corrosion resistance,play a pivotal role in sectors like aerospace,automotive,electronics,and heat exchange systems.This review aimed to explore the application and significance of copper alloys in the AM domain,summarizing their fundamental properties and their synergy with AM technologies,and delve into the physical,chemical,and mechanical properties of copper and its alloys,and assess key AM techniques such as selective laser melting(SLM),electron beam melting(EBM),laser metal deposition(LMD),and directed energy deposition(DED),with a focus on the unique requirements and challenges of copper alloy AM processes,including case studies.The specific applications of copper alloys in AM and examples from various industries were discussed.The review also analyzed factors affecting the quality of copper alloy AM,such as material characteristics,process parameters,and equipment features,and considered performance optimization through post-processing techniques.Finally,the challenges in the copper alloy AM field and predict future technological trends were summarized,providing a reference framework for future research and industrial applications in this area.

关 键 词：铜合金 增材制造 选择性激光熔化 电子束熔化 激光金属沉积 定向能量沉积 后处理技术 

分 类 号：TG146.11[一般工业技术—材料科学与工程]