包覆层熔体温度对7075/6061复合界面组织及硬度的影响  

Effects of Cladding Melt Temperature on Microstructure and Hardnessof 7075/6061 Compound Interface

作　　者：晓琳 郑小平 谢文杰 郝梓煜 张世旭 牛梦娇 韩玉雪 SUXiaolin;ZHENGXiaoping;XIEWenjie;HAOZiyu;ZHANGShixu;NIUMengjiao;HANYuxue(Yisheng College,North China University of Science and Technology,Tangshan 063210,China;College of Metallurgy and Energy,North China University of Science and Technology,Tangshan 063210,China)

机构地区：[1]华北理工大学以升创新教育基地,河北唐山063210 [2]华北理工大学冶金与能源学院,河北唐山063210

出　　处：《热加工工艺》2025年第7期90-94,共5页Hot Working Technology

基　　金：国家自然科学基金项目(51474091);华北理工大学大学生创新创业项目(X2021122)。

摘　　要：利用固/液复合法制备了7075/6061双金属复合铸锭,分析了包覆层6061铝合金熔体温度对复合界面组织、成分与硬度的影响规律,探讨了复合界面的冶金结合机制。结果表明:剪切平台可有效去除内层7075铝合金半固态坯料的表层氧化物,使得复合界面纯净无污染;随着包覆层熔体温度的升高,复合界面的Cu、Mn、Zn元素扩散距离逐渐增大,界面宽度逐渐增大,内层合金的半固态组织呈枝晶化演变趋势增强;复合界面主要以熔体对流与原子扩散的协同作用实现高效冶金结合。7075/6061 bimetal composite ingot was prepared by solid/liquid compound method.The influence of the melt temperature of cladding 6061 alloy on the microstructure,composition and hardness of the compound interface was analyzed,and the metallurgical bonding mechanism of the compound interface was discussed.The results show that the shear platform can effectively remove the surface oxide of the inner 7075 alloy semi-solid billet,so that the compound interface is pure and pollution-free.With the increase of cladding melt temperature,the diffusion distances of Cu,Mn and Zn elements at the compound interface gradually increase,and the interface width gradually increases,and the semi-solid microstructure of the inner alloy exhibits an enhanced dendritic evolution trend.The interface mainly realizes efficient metallurgical bonding by synergistic effect of melt convection and atomic diffusion.

关 键 词：双金属复合材料 固/液复合 铝合金 界面组织 

分 类 号：TB331[一般工业技术—材料科学与工程]