PTFE高频印制电路板低温辅助微孔钻削特性研究  

Low Temperature-Assisted Microhole Drilling Characteristics of PTFE High-Frequency Printed Circuit Board

作　　者：赵永锋 姚俊雄 胡传红 孙勇 徐向前 郑李娟[1,2] 王成勇 Zhao Yongfeng;Yao Junxiong;Hu Chuanhong;Sun Yong;Xu Xiangqian;Zheng Lijuan;Wang Chengyong(School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou Guangdong 510006,China;State Key Laboratory for High Performance Tools,Guangzhou Guangdong 510006,China;Guangzhou Fastprint Circuit Tech Co.,Ltd.,Guangzhou Guangdong 510663,China)

机构地区：[1]广东工业大学机电工程学院,广东广州510006 [2]高性能工具全国重点实验室,广东广州510006 [3]广州兴森快捷电路科技有限公司,广东广州510663

出　　处：《硬质合金》2025年第2期87-98,共12页Cemented Carbides

基　　金：国家自然科学基金面上项目(51875110);广东工业大学与广州兴森快捷电路科技有限公司合作的横向项目(XSSZ-QT-2020027)。

摘　　要：聚四氟乙烯(PTFE)凭借其高介电常数和低介电损耗被认为是高频微波板介质基板的理想材料,但其在机械钻孔时易因热量累积出现排屑不畅、碎屑严重粘附、孔壁污渍残留等问题,极大地影响了高频微波板的信号传输能力及可靠性。因此,本文创新性地提出内喷式冷风辅助制孔工艺(简称“内冷”),进行了高频微波板钻孔实验研究,对比了常温、外冷及内冷3种工艺下,两种典型高频微波板钻孔时的刀具残屑、碎屑粘附、刀具磨损。结果表明:加工扁平玻纤陶瓷PTFE板时,内冷钻孔可有效改善切屑缠绕,但对减小刀具磨损效果十分有限;低温介质有效减小了切削过程中材料的塑性变形,在外冷和内冷条件下更易形成短锥螺旋状切屑;而在加工E型玻纤PTFE板时,由于没有陶瓷等硬质填料对刀具刃口与后刀面的强烈冲击,3种加工方式下的刀具磨损均明显小于扁平玻纤陶瓷PTFE板;内冷钻孔和外冷钻孔均能有效降低切屑粘附刀具现象,防止螺旋槽堵塞,并由于内冷钻削时,低温介质作用更为直接有效,可最大程度地避免树脂进入熔融态而粘附于刀具和切屑表面。研究结果发现,内冷钻削工艺更适用于E型玻纤PTFE板的微孔加工,可有效促进孔内切屑排出,防止切屑在刀具螺旋槽内的累积聚合。Polytetrafluoroethylene(PTFE)has a high dielectric constant and low dielectric loss,which is considered an ideal material for the dielectric layer in high-frequency microwave boards.However,when it is mechanically drilled,it is easy to accumulate heat,resulting in problems such as poor chip removal,serious adhesion of debris,and residual stains on the hole wall,which greatly affects the signal transmission capability and reliability of high-frequency microwave boards.Therefore,this paper innovatively put forward the internal spraying cold air-assisted hole making process(internal cooling for short)and compared the tool debris,chip adhesion,and tool wear when drilling holes for two typical high-frequency microwave boards under the three processes of room temperature,external cooling,and internal cooling.The results show that when processing flat glass fiber ceramic PTFE board,internal cold drilling can effectively improve chip entanglement,but the effect of reducing tool wear is very limited;low temperature medium effectively reduces the plastic deformation of the material in the cutting process,and it is more likely to form a short conical spiral chip under the conditions of external and internal cooling.When processing E-type glass fiber PTFE board,due to the lack of ceramic and other hard filler impact on the tool edge and flank surface,the tool wear under the three processing modes is significantly smaller than that of flat glass fiber ceramic PTFE board;both internal and external cold drilling can effectively reduce the adhesion of chips to the tool to prevent the spiral groove from clogging.In addition,due to the direct and effective role of the low temperature medium in internal cold drilling,it can prevent the resin from reaching the molten state to a maximum extent,so as to avoid the resin adhering to the tool and the surface of the chips.It is found that the internal cold drilling process is more suitable for the microhole processing of E-type glass fiber PTFE boards,which can effectively promote the dis

关 键 词：高频微波板 微孔 低温钻削 切屑形貌 刀具磨损 

分 类 号：TN41[电子电信—微电子学与固体电子学]