铜银核壳粉末复合导电浆料的制备及其性能研究  

Preparation and properties of copper-silver core-shell powder composite conductive paste

作　　者：温奇辉 张雪辉 刘柏雄 曾龙飞 杨斌 WEN Qihui;ZHANG Xuehui;LIU Baixiong;ZENG Longfei;YANG Bin(School of Materials Science and Engineering,Jiangxi University of Science and Technology,Ganzhou 341000,Jiangxi,China)

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000

出　　处：《有色金属科学与工程》2025年第2期245-254,共10页Nonferrous Metals Science and Engineering

基　　金：江西省重大科技研发资助项目(20223AAG01009);国家自然科学基金资助项目(52361021)。

摘　　要：采用化学镀制备了银层分布均匀致密的铜银核壳粉末,以此为原料,系统探究了粉末含量、烧结温度和保温时间对导电浆料性能的影响。首先,改变铜银核壳粉末含量(指质量分数,下同)(65%~85%),发现随着粉末含量增加,导电浆料的导电性能显著提升,但当含量达到一定阈值后,性能趋于稳定。其次,烧结温度优化结果表明,700℃为较优烧结温度,此时导电浆料具有最低的方阻和较优的表面形貌。过高的烧结温度会导致粉末异常长大,影响导电网络的致密性。保温时间优化结果表明,保温时间为15 min能够获得较优的固化效果,导电浆料具有最低的方阻和最致密的导电网络。这为高性能、低成本导电浆料的制备提供了技术途径和理论依据。In this study,copper-silver core-shell powder with a uniform and dense silver layer was prepared by electroless plating,and the effects of powder content,sintering temperature,and holding time on the properties of conductive slurry were systematically investigated,respectively.Firstly,the electrical conductivity of the paste improved significantly as the copper-silver core-shell powder content increased from 65% to 85%.However,the conductivity improved stably once a certain threshold was reached.Secondly,optimization of the sintering temperatures showed that 700 ℃ was the optimum one.The paste had the lowest square resistance at this temperature yet the best surface morphology.However,excessive sintering temperatures resulted in abnormal grain growth of the powder,negatively affecting the density of the conductive network.Finally,optimization of the holding time showed that 15 minutes provided the best curing effect,making the paste the lowest resistivity and the densest conductive network.The results of this research provided a technical approach and theoretical basis for the preparation of high-performance,low-cost conductive pastes.

关 键 词：铜银核壳粉末 导电浆料 烧结温度 保温时间 导电性能 

分 类 号：TN604[电子电信—电路与系统]