加成型电子器件灌封材料开发与性能研究  

Development and performance research of potting materials for additive electronic devices

作　　者：王立鹏 WANG Li-peng(Tangshan Sanyou Silicon Industry Co.,Ltd.,Hebei Innovation Center of Silicone New Material Technology,Tangshan 063305,China)

机构地区：[1]唐山三友硅业股份有限公司,河北省有机硅新材料技术创新中心,河北唐山063305

出　　处：《精细与专用化学品》2025年第4期13-15,19,共4页Fine and Specialty Chemicals

摘　　要：研究了通过聚合物的优化调整,实现灌封胶性能提升。结果表明,固体填充粉料(氢氧化铝、硅微粉等)添加量占总质量的比例达到70%时,聚合物分别选择100份500cs黏度端乙烯基硅油、4份10000cs高黏度端乙烯基硅油和含氢值0.33%侧链含氢硅油,聚合物硅氢比值为3.1,胶料具有良好的机械强度、流平性与抗沉降效果,且固化完全、表面有光泽。The performance of potting materials can be improved through the optimization and adjustment of polymers.The results showed that the most suitable formula was the mass proportion of powder reached 70%(based on total mass of potting materials),100 parts of 500cs low-viscosity end vinyl silicone oil,4 parts of 10000cs high-viscosity end vinyl silicone oil and 0.33%side-chain hydrogen-containing silicone oil,and the polymer silicon-hydrogen ratio was 3.l.The potting materials had good mechanical strength,leveling and antisedimentation effect,and the curing was complete and the surface was shiny.

关 键 词：含氢硅油 端乙烯基硅油 硅氢加成 

分 类 号：TQ264[化学工程—有机化工]