聚醚原位热裂解制备多孔低介电聚酰亚胺薄膜  

Preparation of Porous Low-dielectric Polyimide Films by InSitu Thermal Polyether Pyrolysis

作　　者：黄厚恒 赵溪 史声宇 史恩台 HUANG Houheng;ZHAO Xi;SHI Shengyu;SHI Entai(School of Microelectronics,Hefei University of Technology,Hefei 230009,China;School of Chemical and Environmental Engineering,Anhui Polytechnic University,Wuhu 241000,China;Anhui Guofeng New Materials Co.,Ltd.,Hefei 230000,China)

机构地区：[1]合肥工业大学微电子学院,安徽合肥230009 [2]安徽工程大学化学与环境工程学院,安徽芜湖241000 [3]安徽国风新材料股份有限公司,安徽合肥230000

出　　处：《山东化工》2025年第7期33-35,39,共4页Shandong Chemical Industry

摘　　要：通过聚醚热裂解技术制备了多孔低介电聚酰亚胺薄膜,探讨了其制备过程及性能。采用4,4′-二氨基二苯醚(4,4-ODA)和均苯四甲酸酐(PMDA)在N,N-二甲基乙酰胺(DMAC)与聚乙二醇二甲醚(PEGDME)溶液中合成聚酰胺酸溶液,经过涂膜和亚胺化处理后,在280℃恒温5 h持续热裂解,形成孔洞结构。研究结果表明,该薄膜具有优异的低介电特性,适合用于电路中间层材料。本文为低介电聚酰亚胺薄膜的制备提供了新的思路与方法。This study presents the preparation of porous low-dielectric polyimide films using polyether pyrolysis technology,focusing on the fabrication process and material performance.A polyamic acid solution was synthesized through the reaction of ODA and PMDA in DMAC and PEGDME solution.Following coating and imidization,thermal pyrolysis was conducted at 280℃for 5 hours,forming a porous structure.The findings demonstrate that the resulting film offers excellent low-dielectric properties,making it a promising candidate for interlayer applications in circuits.This work offers fresh insights and novel approaches to the preparation of low-dielectric polyimide films.

关 键 词：聚酰亚胺 热裂解 低介电 孔洞结构 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]