Ka波段小型化多通道新型封装天线设计  

Design of a New Miniaturized Multi-Channel Antenna in Package for Ka-Band

作　　者：杨兆龙 刘林杰[1,2] 乔志壮 Yang Zhaolong;Liu Linjie;Qiao Zhizhuang(The 13th Research Institute,CETC,Shijiazhuang 050051,China;School of Microelectronics,Xidian University,Xi'an 710126,China;School of Electronic Engineering,Xidian University,Xi'an 710071,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051 [2]西安电子科技大学微电子学院,西安710126 [3]西安电子科技大学电子工程学院,西安710071

出　　处：《微纳电子技术》2025年第5期38-45,共8页Micronanoelectronic Technology

摘　　要：封装天线(AiP)是一种能够实现低成本制备、高性能以及小体积天线的技术,在移动通信等领域有着广泛的应用。目前以高温共烧陶瓷(HTCC)作为封装材料的AiP大多属于多层结构,通过牺牲天线尺寸来实现宽带和高增益特性,结构复杂,集成度较低。提出了一种新型的小型化封装天线结构。以HTCC作为介质基板材料,通过将传统Vivaldi天线和微带八木天线相结合,在保证天线有足够增益的前提下有效减小了天线尺寸。设计并制备了六通道的AiP结构,天线单元尺寸仅为9 mm×5.7 mm×1.5 mm,实现了小型化和多通道的特性。仿真结果表明在中心频率34.5 GHz处,增益为5.08 dBi,电压驻波比小于1.5,测试结果与仿真结果吻合较好。提出的AiP具有结构简单、小型化和集成度高的优势,同时满足多通道无线通信的需求,在毫米波无线通信系统中具有很大的应用潜力。Antenna in package(AiP)is a technology that can achieve low cost preparation,high performance and small size antenna,and has wide applications in mobile communication and other fields.At present,AiPs with high-temperature co-fired ceramic(HTCC)as the packaging material mostly belong to multilayer structures,which realize the characteristics of broadband and high-gain by sacrificing antenna dimensions,and have complex structures and low integration.A new miniaturized AiP structure was proposed.With HTCC as the dielectric substrate material and by combining the traditional Vivaldi antenna with the microstrip Yagi antenna,the antenna size is effectively reduced on the premise of ensuring sufficient antenna gain.A six-channel AiP structure was designed and fabricated with the antenna unit size of only 9 mm×5.7 mm×1.5 mm,achieving the characteristics of miniaturization and multi-channel.The simulation results indicate that the test results are in good accordance with the simulation results at the center frequency of 34.5 GHz,the gain of 5.08 dBi and the voltage standing wave ratio of less than 1.5.The proposed AiP has the advantages of a simple structure,miniaturization and high integration,and concurrently meets the requirements of multi-channel wireless communication,thus having significant application potential in millimeter-wave wireless communication systems.

关 键 词：封装天线(AiP) 小型化 多通道 KA波段 高温共烧陶瓷(HTCC) 

分 类 号：TN305.94[电子电信—物理电子学]