6H-SiC纳米磨削机理的分子动力学研究  

Study on the Nano-grinding Mechanism of 6H-SiC Based on Molecular Dynamics

作　　者：耿瑞文 周星辰 田助新 谢启明[3] 李立军 吴海华[1] 双佳俊 杨志豇 GENG Ruiwen;ZHOU Xingchen;TIAN Zhuxin;XIE Qiming;LI Lijun;WU Haihua;SHUANG Jiajun;YANG Zhijiang(Hubei Engineering Research Center of Graphite Additive Manufacturing Technology and Equipment,China Three Gorges University,Yichang 443002,Hubei,China;College of Mechanical and Power Engineering,China Three Gorges University,Yichang 443002,Hubei,China;Kunming Institute of Physics,Kunming 650223,China)

机构地区：[1]三峡大学石墨增材制造技术与装备湖北省工程研究中心,湖北宜昌443002 [2]三峡大学机械与动力学院,湖北宜昌443002 [3]昆明物理研究所,昆明650223

出　　处：《材料导报》2025年第10期46-53,共8页Materials Reports

基　　金：湖北省技术创新专项重大项目(2019AAA164);三峡大学人才引进项目(2022Y0037);水电机械设备设计与维护湖北省重点实验室开放基金(2023KJX04)。

摘　　要：6H-SiC作为先进半导体材料的代表,具有出色的物理性能和化学稳定性,在光电子、航空航天等高新技术产业中起着关键作用。高硬度和低断裂韧性的物理特性使6H-SiC在超精密加工过程中充满挑战。因此,本工作采用分子动力学模拟的方法,探究了6H-SiC在不同磨粒形状(球形、圆台形、四棱台形)下的纳米磨削行为,并深入分析了磨削深度对纳米磨削特征的影响。结果表明:四棱台形磨粒在材料去除效率方面表现最佳,但伴随着最大的亚表面损伤;在较深的磨削条件下球形磨粒的材料去除率超过了圆台形磨粒,并且亚表面损伤小。此外,随着磨削深度的增加,材料去除机制发生转变,磨削力和磨削温度也有所增加,同时磨粒形状对磨削质量的影响也更加显著。研究结果为6H-SiC等硬脆性材料工艺参数优化提供了理论依据。6H-SiC,as a representative of advanced semiconductor materials,exhibits outstanding physical properties and chemical stability,playing a pivotal role in high-tech industries such as optoelectronics and aerospace.Its high hardness and low fracture toughness present a great challenge in ultra-precision machining.Consequently,this study employs molecular dynamics simulation to investigate the nano-grinding behavior of 6H-SiC under different abrasive shapes(spherical,truncated cone,quadrangular frustum pyramid)and analyzes the influence of grinding depth on nano-grinding characteristics comprehensively.The results indicated that quadrangular frustum pyramid abrasives demonstrate optimal material removal efficiency,albeit accompanied by the largest subsurface damage.Under deeper grinding conditions,the spherical abrasive particles exhibit a material removal rate that surpasses that of the truncated cone particles,and they induce less subsurface damage.Furthermore,as grin-ding depth increases,a transition of the material removal mechanism occurrs,accompanied by increased grinding force and temperature,while the impact of abrasive shape on grinding quality becomes more pronounced.These findings provide a theoretical foundation for optimizing processing parameters of hard brittle materials like 6H-SiC.

关 键 词：6H-SIC 分子动力学 纳米磨削 磨削深度 磨粒形状 亚表面损伤 

分 类 号：O77[理学—晶体学]