Ni/P质量比对Cu-Ni-P合金组织和性能的影响  

Effect of Ni/P Mass Ratio on Microstructure and Properties of Cu-Ni-P Alloy

作　　者：张建波[1] 沈琪飞 尹宁康 张晋涵 刘敬萱 ZHANG Jianbo;SHEN Qifei;YIN Ningkang;ZHANG Jinhan;LIU Jingxuan(Faculty of Materials Metallurgy and Chemistry,Jiangxi University of Science and Technology,Ganzhou 341000,Jiangxi,China;Jiangxi Advanced Copper Industry Research Institute,Yingtan 335000,Jiangxi,China)

机构地区：[1]江西理工大学材料冶金化学学部,江西赣州341000 [2]江西先进铜产业研究院,江西鹰潭335000

出　　处：《材料导报》2025年第10期206-211,共6页Materials Reports

基　　金：江西理工大学高层次人才科研启动基金(205200100541);江西省教育厅科技项目(GJJ210872);国家铜冶炼与工艺工程技术研究中心资助项目(20231ZDD0205)。

摘　　要：本工作结合相图计算设计制备了不同Ni/P质量比的Cu-Ni-P合金。借助金相(OM)、扫描电子显微镜(SEM)、透射电子显微镜(TEM)、硬度和导电率试验,研究了Ni/P质量比对合金组织和性能的影响,建立了析出相的演变与硬度和导电率的关系。结果表明,Ni/P质量比对合金的硬度和导电率有显著影响。其中Ni/P质量比为4时,合金在500℃下时效3 h时硬度和导电率分别达到171HV和61.8%IACS的最大值。P含量的增加促进了Ni原子从Cu基体中析出,降低了溶质原子的浓度,从而提高了合金的导电性。在时效初期,球状的NiP_(3)相大量存在是合金硬度上升的主要原因。随着时效的进行,合金中的析出相逐渐演变为球状的NiP_(2)相和短棒状的Ni_(2)P相。The Cu-Ni-P alloys were designed and prepared with varying Ni/P mass ratios based on phase diagrams.The effects of the Ni/P mass ratio on the microstructure and properties of the alloys were investigated by means of optical microscopy(OM),scanning electron microscopy(SEM),transmission electron microscopy(TEM),hardness and conductivity tests.In addition,the correlation between the evolution of precipitated phase and the hardness and conductivity has been established.The results show that the Ni/P mass ratio has a significant impact on the both hardness and conductivity of the alloy.After aging at 500℃ for 3 h,the hardness and conductivity of the alloy with a Ni/P mass ratio of 4 reached the maximum of 171HV and 61.8%IACS,respectively.The increase in P content facilitates the precipitation of Ni atoms from the copper matrix,thereby reducing the concentration of solute atoms and ultimately enhancing the electrical conductivity of the alloy.In the early stage of aging,abundant spheroidal NiP_(3)phase formation serves as a primary factor contributing to increased alloy hardness.During the aging process,the precipitates in the alloy gradually transforms into spherical NiP_(2)and short rod-like Ni_(2)P phases.

关 键 词：Cu-Ni-P合金 Ni/P质量比 硬度 导电率 微观组织 

分 类 号：TG146.1[一般工业技术—材料科学与工程]