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作 者:赵童刚 安百江 王伟 ZHAO Tong-gang;AN Bai-jiang;WANG Wei(Shaanxi Baoguang Ceramic Technology Co.Ltd.,Baoji 721304,China)
机构地区:[1]陕西宝光陶瓷科技有限公司,陕西宝鸡721304
出 处:《真空电子技术》2025年第2期37-40,共4页Vacuum Electronics
摘 要:氧化铝陶瓷具有良好的机械强度和电气绝缘性能,钛合金TC4具有低密度、高机械强度和耐腐蚀性能,研究氧化铝陶瓷与TC4的气密钎焊工艺,对应用于航空航天等领域气密绝缘器件性能的改善具有重要意义。采用AgCu28钎料,分别对氧化铝陶瓷与TC4直接钎焊和氧化铝陶瓷金属化后与TC4间接钎焊进行了试验。结果表明,氧化铝陶瓷金属化后与TC4钎焊的焊接强度及气密性良好,能够满足高真空器件的要求,相较于陶瓷金属化后钎焊,直接钎焊虽然也能实现气密,但焊接应力较大,强度较低。Alumina ceramics have good mechanical strength and electrical insulation properties,while TC4 titanium alloy has low density,high mechanical strength,and corrosion resistance.The study of airtight brazing process between alumina ceramics and TC4 titanium alloy is of great significance for improving the performance of airtight insulation devices applied in aerospace and other fields.AgCu28 brazing material is used to test the direct brazing of alumina ceramics with TC4 and the indirect brazing of metallized alumina ceramics with TC4.The experimental results show that the indirect brazing has good welding strength and airtightness and can meet the requirements of high vacuum devices;compared to the indirect brazing,the direct brazing can also achieve airtightness,but the welding stress is higher and the strength is lower.
分 类 号:TN105[电子电信—物理电子学]
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