Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers  

Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers

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作  者:LanHUANG HaoYingSHEN  

机构地区:[1]NationalLaboratoryofMolecularandBiomolecularElectonics,SoutheastUniversity,Nanjing210096 [2]InstituteofElectronDevices,Nanjing210016

出  处:《Chinese Chemical Letters》2002年第2期163-164,共2页中国化学快报(英文版)

基  金:This work was supported by the National Natural Science Foundation of the Peoples Republic of China (No. 69890220).

摘  要:A new method has been developed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs). As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features. The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.A new method has been developed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs). As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features. The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.

关 键 词:Micro-pattern DEPOSITION photolithograph SAMS MPTS SEM. 

分 类 号:O614.121[理学—无机化学]

 

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