A New Activation Method for Electroless Metal Plating: Palladium Laden via Bonding with Self-Assembly Monolayers  

作　　者：LiNaXU JianHuiLIAO 等 

机构地区：[1]DepartmentofChemistryandChemicalEngineering,SoutheastUniversity,Nanjing210096 [2]NationalLaboratoryofMolecularandBiomolecularElectronics,SoutheastUniversity,Nanjing210096

出　　处：《Chinese Chemical Letters》2002年第7期687-688,共2页中国化学快报（英文版）

基　　金：This work was supported by the National Natural Science Foundation of China (No.69890220);Promotional Foundation of Ministry of Education of China for excellent youth teacher (2000) ; Open Project Foundation of Laboratory of Solid State Microstruct

摘　　要：A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition. A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation. XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition. A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation. XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.

关 键 词：Palladium chemisorption amino group SAMS ACTIVATION electroless plating. 

分 类 号：O614.823[理学—无机化学] O64[理学—化学]