降低陶瓷与陶瓷或金属连接温度的技术  

Techniques for Lowering The Bonding Temperature in Ceramic to Ceramic or Metal Bonding Research

作　　者：邹贵生[1] 杨俊[1] 吴爱萍[1] 巫世杰[2] 顾兆旃[2] 

机构地区：[1]清华大学机械工程系,北京100084 [2]航天材料及工艺研究所,北京100076

出　　处：《宇航材料工艺》2002年第6期1-5,13,共6页Aerospace Materials & Technology

基　　金：航天科技创新基金;清华大学骨干人才支持计划;国家自然科学基金项目 :5 0 0 75 0 46

摘　　要：为降低陶瓷与陶瓷或金属的连接温度 ,目前采用的连接方法有过渡液相扩散连接、半固态连接、机械连接、粘接、铟封和陶瓷表面低温改性后低温钎焊等。本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。To lower the bonding temperature of ceramic to ceramic or metal, several methods have been used. These methods include transient liquid phase bonding, semi solid bonding, mechanical bonding, cementation, indium sealing, low temperature soldering after ceramic surface property improvement at low temperature and so on. This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantages and disadvantages, etc.

关 键 词：金属 连接温度 陶瓷 低温连接 过渡液相扩散连接 半固态连接 表面改性 

分 类 号：TQ174.1[化学工程—陶瓷工业]