K4玻璃与可伐合金的阳极焊机理分析  

Mechanism of Anodic Bonding between K4 Glass and Kovar Alloy

作　　者：喻萍[1] 孟庆森[1] 张丽娜[1] 潘川[2] 薛锦[1] 

机构地区：[1]西安交通大学机械工程学院,西安710049 [2]北京钢铁研究总院焊接实验室

出　　处：《西安交通大学学报》2003年第1期26-28,共3页Journal of Xi'an Jiaotong University

基　　金：国家"2 1 1工程"资助项目(20304006).

摘　　要：通过K4玻璃与可伐合金的阳极焊试验,初步研究了在阳极焊过程中离子的传输和结合机理,即在外加电场和温度的作用下使焊接材料中发生离子的迁移,从而使阳极焊得以实现.通过K4玻璃与铝片焊接的对比试验,说明材料的线膨胀系数对焊接过程产生了极大的影响.利用扫描电镜(SEM)、透射电镜(TEM)和X射线衍射(XRD)等手段对界面的微观结构进行分析,认为在K4玻璃与可伐合金的结合面处形成了以FeSiO3和Fe7SiO10以及一些非晶态物质为主的过渡层,将K4玻璃与可伐合金连接在一起,并发现被焊材料的热膨胀系数对阳极焊质量有着重要的影响.The mechanism of anodic bonding and ion drift processes between K4 glass and Kovar alloy, are investigated. Ions migrated under certain temperature and electric field and made the K4 glass and Kovar alloy bonded together. It is suggested that the linear thermal expansion coefficient plays an important role in bonding process through contrast test of anodic bonding between K4 glass and aluminum. The microstructure of the K4 glass-Kovar alloy interface is investigated by means of SEM, TEM, XRD, and the result indicates that the composition of the interface is made up of orthoferrosilite, silicoferrite(Iscorite) and some kind of noncrystal material. It is found that the thermal coefficients of expansion of the welded materials play an important role in the anodic bonding.

关 键 词：阳极焊 可伐合金 K4玻璃 结合机理 离子传输机理 界面结构 

分 类 号：TG456.9[金属学及工艺—焊接]