W或C添加剂对优化CuCr25合金显微组织的作用  

Influence of W or C Adding on the Microstructure of CuCr25 Alloys

作　　者：王立彬[1] 张程煜[1] 丁秉钧[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2003年第1期41-44,共4页Rare Metal Materials and Engineering

基　　金：国家863计划资助项目(715-005-0160)

摘　　要：采用真空感应熔炼法制备CuCr25(W),与Cr25(C)合金,研究不同合金元素W,C对CuCr触头微观组织的影响。研究结果表明,W和C能够显著细化Cr相晶粒,W对Cr相晶粒还有球化作用,同时对Cr相进行了强化。使合金整体性能得到提高,其中耐电压强度得到显著提高。The preparation of CuCr25(C) and CuCr25(W) alloys by vacuum inducing melting is presented in this paper. The influence of different alloy elements(C&W) on Cr-crystalline grain is studied. And the sequent effects on the physical properties and breakdown voltage are also discussed. It is found that the mechanical strength and the voltage withstanding stress have been improved for the alloys with adding of C or W.

关 键 词：CuCr25合金 显微组织 触头材料 真空感应熔炼 钨 碳 

分 类 号：TG13[一般工业技术—材料科学与工程]