氰酸酯树脂的研究进展及其在微电子工业的应用  

ADVANCE OF THE RESEARCH OF MODIFIED CYANATE RESINS AND IT'S APPLICATIONS IN MICROELECTRONIC INDUSTRY

作　　者：李齐方[1] 杨庆泉[1] 金日光[1] 

机构地区：[1]北京化工大学材料科学与工程学院,北京100029

出　　处：《工程塑料应用》2002年第12期34-36,共3页Engineering Plastics Application

基　　金：北京市科技新星计划资助项目(9558101200)

摘　　要：介绍了氰酸酯树脂(CE)的发展史、合成方法、性能、改性体系及其在微电子工业的应用,展望了CE的发展方向。CE是近年来发展起来的一种新型工程塑料,具有极低的介质损耗角正切值、优异的耐湿热性能和力学强度,是一种有广泛应用前景和强劲市场竞争力的材料。The history, synthesis, properties, modification and application in the microelectronic- industry of cyanate resin are introduced. The development tendency of cyanate resin is also discussed. Cyanate resin is a newly developing engineering plastics with excellent hot/wet service temperature, dielectric and mechanical performance. It has widely applied perspective and will be very competitive in market with other engineering plastics.

关 键 词：氰酸酯树脂 研究进展 微电子工业 应用 

分 类 号：TQ326.9[化学工程—合成树脂塑料工业] TN04[电子电信—物理电子学]