化学镀Ni－Sn－P三元合金的工艺和性能的研究  

Investigation of Technology and Performance of the Electroless-deposited Film of Ni-Sn-P Alloy

作　　者：司秀丽[1] 吴丰 褚松竹[1] 

机构地区：[1]沈阳工业大学,东北大学

出　　处：《功能材料》1995年第2期189-192,共4页Journal of Functional Materials

摘　　要：在确定的化学镀Ｎｉ－Ｓｎ－Ｐ镀液组成的条件下，研究了工艺参数（镀液温度和ｐＨ）对沉积速度和镀层中含锡量及含磷量的影响，并对该合金镀层的结构、孔隙率及耐蚀性能进行了测试。结果表明：在一定的工艺条件下获得的非晶态合金镀层具有较小的孔隙率和良好的耐蚀性能。The effects of temperature and pH onthe deposition rate and the contents of Sn and P inthe Ni-Sn-P alloy coatings were investigated withgiven bath compositions. The structure,pinholes andcorrosion resistance of the alloy coatings were tested.The results showed that the amorphous. Ni-Sn-Palloy coatings obtained under suitable conditions haveless pinholes and better corrosion resistance.

关 键 词：化学镀 Ni-Sn-P合金 耐腐蚀性 

分 类 号：TQ153.2[化学工程—电化学工业]