抗菌耐蚀性功能复合镀层(Ag)-Ni/Cr的开发研究  

Development and Study of the (Ag)-Ni/Cr Composite Plating with Antibacterial Properties and Corrosion Resistance

作　　者：赵亚萍[1] 王锦华[2] 印仁和[1] 郑金[1] 余乐书[1] 

机构地区：[1]上海大学理学院化学系,上海200436 [2]上海大学生命科学学院,上海200436

出　　处：《电化学》2003年第1期71-75,共5页Journal of Electrochemistry

基　　金：固体表面化学国家重点实验室 (991 7)资助

摘　　要：　通过正交试验法,在优化电镀工艺条件基础上,开发并研制了一种新型金属表面功能材料(Ag)-Ni/Cr复合镀层,并分别利用菌落计数法和交流阻抗法比较镀层抗菌和耐腐蚀性能.研究表明,该镀层具有抗菌性和耐蚀性兼顾的特点,极具广阔的应用前景.The 3_factor and 3_level orthogonal experiment was designed and through the comparison of the different films' antibacterial properties measured by bacterial colony counting and the corrosion resistance studied with the AC impedance method. The optimal plating conditions of the (Ag)_Ni/Cr composite plating, a novel functional plating, were determined.The results have indicated that the (Ag)_Ni/Cr composite plating is characterized by both antibacterial and corrosion resisting properties and has its wide applied prospect.

关 键 词：功能复合镀层 正交试验 菌落计数法 交流阻抗 抗菌性 耐蚀性 银 镍 铬 

分 类 号：TQ153[化学工程—电化学工业]