Relative Stability of Boiling of FC-72 and HFE-7100 with Applications toElectronic Device Cooling  

作　　者：Z.W.LIU X.F.PENG 等 

机构地区：[1]DepartmentofChemicalEngineering,NationalTaiwanUniversity,Taipei10617,Taiwan,China [2]DepartmentofThermalEngineering,TsinghuaUniversity,Beijing100084,China

出　　处：《Journal of Thermal Science》2000年第4期352-355,共4页热科学学报（英文版）

摘　　要：This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, qc, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) qc increases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.

关 键 词：BOILING relative stability FC-72 HFE-7100 subcooling. 

分 类 号：O552.6[理学—热学与物质分子运动论]