声光器件的关键技术——高真空铟压焊  

The key Technique of Acousto-Optic Devices——High Vacuum Indium Bonding

作　　者：杨淑兰[1] 林明毓[1] 黎俊杰[1] 

机构地区：[1]中国科学院光电技术研究所,成都610209

出　　处：《光电工程》1992年第6期17-26,共10页Opto-Electronic Engineering

摘　　要：本文主要介绍声光器件的关键技术-高真空高纯铟压焊技术。文中分析了环氧树脂粘接、超声焊、铟热压焊、铟冷压焊等技术的特点,并给出铟热压焊与冷压焊的主要工艺参数和注意事项及其对声光器件性能的影响。声光器件一般都采用铟冷压焊,而大器件与长换能片或多片焊接则采用铟热压焊。In this paper, the key technique of the acousto-optic devices highvacuum and high purity indium bonding is described.The features of the resinoidbonding,the ultrasonic bonding and the indium bonding are analysed in detail.The technological parameters of the hot indium bonding and the cold indiumbonding are also presented.In general, the cold indium bonding is adopted in theacousto optic devices. On the contrary, the hot indium bonding is adopted inlarge devices, long transducer devices or multi piece bonding.

关 键 词：声光器件 真空镀膜 粘接 真空焊 

分 类 号：TN65[电子电信—电路与系统]