Cu-Cr触头合金制备技术的发展  

THE DEVELOPMENT OF MANUFACTURE PROCESSING FOR Cu-Cr CONTACT ALLOY

作　　者：冼爱平[1] 朱耀宵[1] 

机构地区：[1]中国科学院金属研究所,沈阳110016

出　　处：《金属学报》2003年第3期225-233,共9页Acta Metallurgica Sinica

基　　金：国家自然科学基金59981005;辽宁省科学技术重点基金2001101004资助项目

摘　　要：通过对近年来Cu-Cr合金制备技术的回顾,综述了Cu-Cr合金制备技术的进展.论述了该合金的化学成分及显微组织对电性能的影响,包括Cr含量的影响、第三组元的影响、合金中杂质的影响、 Cr粒子宏观分布的影响、 Cr粒子尺寸的影响、合金致密度的影响、热处理工艺的影响以及表面老炼处理的影响.介绍并分析了Cu-Cr合金的几种主要制备工艺,包括粉末烧结法、熔渗法、电弧熔炼法、自耗电极法以及最近发展起来的低偏析熔铸法;最后,对Cu-Cr合金进一步发展方向,如发展熔铸技术、Cr粒子细化、进一步减少Cr含量以及添加第三组元等进行了简要的讨论.The recent development of the manufacture processing for Cu-Cr alloy is reviewed and the review focused on the influence of the chemical composition and microstructure etc. on the switch electrical properties of the alloy, including effects of Cr content, the third element, impurities, macro-segregation, the size of Cr particles, the density of the alloy, and effect of heat treatment. The main manufacture processes of the Cu-Cr alloy, including powder sintering, molten metal infiltrating, self-consuming electrode, arc-melting and the low-segregation molten-casting, are also discussed. Moreover, the developing direction of Cu-Cr alloy used as a contact material is discussed, which includes the development of molten-casting process, decreasing both the Cr content and the average size of the Cr particles, and doping the third element etc.

关 键 词：CU-CR合金 触头材料 制备工艺 

分 类 号：TG172[金属学及工艺—金属表面处理]