C411树脂吸附与解吸金的动力学  

Kinetics of Gold Adsorption with C411 Resin and Elution

作　　者：于道成[1] 经幼苹[1] 柯家骏[1] 

机构地区：[1]中国科学院化工冶金研究所,北京100080

出　　处：《贵金属》1992年第2期1-6,共6页Precious Metals

基　　金：国家自然科学基金

摘　　要：对大孔交联哌啶树脂吸附与解吸金的动力学研究结果表明,吸附和解吸均符合Boyd液膜扩散方程,吸附金的速率是随着HCl浓度的增加而下降。实验测得的吸附扩散系数K=4.75×10^(-4)s^(-1),吸附表观热效应△H=12.43kJ/mol。当温度升高时,吸附金的分配比上升,表明该树脂吸附金是吸热反应。还研究了硫脲解吸金的特性。Kinetics of gold adsorption with new type C411 resin and elution was studied in this paper. The experimental results show that the adsorption and elution can be described by the Boyd diffusion equation of liquid film. The adsorption rate of gold decreases with the increase of HCl concentration. The distribution coeffcient of adsorption is K=4.75×10^(-4)s^(-1) and the apparent heat effect of adsorption is ΔH=12.43kJ/mol. The distribution ratio of gold adsorption increases with the increase of temparature, It is shown that the adsorption process of gold with C411 resin is a heat-absorbing reaction. The elution characteristic of gold with thiourea solution was also studied.

关 键 词：离子交换脂树 金 吸附动力学 

分 类 号：TF831.01[冶金工程—有色金属冶金]