低银导电环材料的研究  

Study on Low Silver Conducting-Ring Materials

作　　者：常秀敏[1] 王建民[2] 欧阳莉莉[1] 闫俊联[1] 

机构地区：[1]北京有色金属研究总院研究开发部,北京100088 [2]华北水利水电学院,河北邯郸056021

出　　处：《稀有金属》2003年第2期307-309,共3页Chinese Journal of Rare Metals

基　　金：国家科工委军工配套项目资助

摘　　要：银合金作为导电环材料 ,因其硬度偏低、耐磨性差 ,影响使用寿命 ,同时 ,还存在价格昂贵的问题。本文通过对合金系的选择 ,经反复实验 ,研制出了一种新型的Cu Ag Ni系低银导电合金 ,并对其组织性能进行了研究 ,在此基础上制得相应的导电环 ,并对其导电性能与工作寿命等性能进行了研究。结果表明 :研制成的低银合金以铜为基 ,选择了能大大提高合金强度、很少降低电阻率、提高抗氧化性能的银、镍等作为添加元素 ;与银合金相比 ,可节约白银 80 %以上 ,显著降低成本 ;低银合金加工工艺简便 ,适用于大批量生产。When silver alloy is used as conducting ring material, its service life is influenced by its slightly low hardness and bad abrasion resistance behavior, meanwhile it is prohibitive. In this paper, a new low silver Cu Ag Ni system conducting alloy was prepared by systematic selection of the alloy systems via repeated experiments. Its structure characteristics were studied, the conducting rings were made and its properties as conductivity and service life were researched. It shows that, compared with silver alloy. The new developed alloy based on copper with iron and Nickel as adding elements which can enhance the strength and anti oxidation ability without reducing the resistivity of the alloy can save 80% of silver and reduce the cost remarkably, its manufacture procession is simple and it is fit to be manufactured in great batches.

关 键 词：导电合金 导电环 电阻率 

分 类 号：TG132.2[一般工业技术—材料科学与工程]