烯丙基硫脲和十二烷基硫醇对铜的缓蚀作用  

Inhibition Effect of Allylthiourea and 1-Dodecanethiol on Copper Corrosion

作　　者：王春涛[1] 陈慎豪[1] 赵世勇[1] 李德刚[1] 

机构地区：[1]山东大学化学与化工学院,济南250100

出　　处：《化学学报》2003年第2期151-155,共5页Acta Chimica Sinica

基　　金：国家自然科学基金 (No.2 0 1 730 33);国家重点基础研究专项经费 (No.G1 9990 650 )资助项目

摘　　要：用自组装技术在铜电极表面上制备了纯烯丙基硫脲自组装膜 ,并以十二烷基硫醇进一步修饰得到混合自组装膜 .最后 ,将混合膜覆盖的铜电极浸入NaCl溶液中 ,进行交流电处理 .电化学交流阻抗谱和极化曲线测定表明 ,经过交流电处理后 ,在 0 .5mol·dm- 3NaCl溶液中 ,电荷传递电阻增大 ,腐蚀电流密度下降 ,膜的最大覆盖度为 98.6% ,对金属铜腐蚀的缓蚀效率为 98.5 % .而且 ,不论交流电处理与否 。Self-assembled monolayer of allylthiourea (AT) was first formed on copper surface. 1-Dodecanethiol (DT) was then self-assembled on the surface for subsequent modification: Finally, AC voltage was loaded on copper covered with the mixed film for further improvement. After these processes, an effective inhibition film was obtained as indicated by the high charge-transfer resistance shown in electrochemical impedance spectroscopy and low corrosion current density in polarization curves. The maximum coverage and inhibition efficiency for copper corrosion was 98.6% and 98.5%, respectively. The mixed film was stable in a wide range of potential before and after AC voltage treatment.

关 键 词：烯丙基硫脲 十二烷基硫醇 铜 缓蚀作用 自组装技术 混合自组装膜 金属 腐蚀 防护 电化学方法 

分 类 号：TG174.4[金属学及工艺—金属表面处理]