聚苯醚改性环氧树脂基覆铜板的研制  

PREPARATION OF THE COPPER CLAD LAMINATE BASED ON MODIFIED EPOXY WITH POLY (2,6-DIMETHYL-1,4-PHENYLENE ETHER)

作　　者：孟季茹[1] 梁国正[1] 何洋[1] 赵磊[1] 朱光明[1] 

机构地区：[1]西北工业大学化学工程系,西安710072

出　　处：《复合材料学报》2003年第1期74-78,共5页Acta Materiae Compositae Sinica

摘　　要：　利用浊点绘制了聚苯醚与溴化环氧树脂体系的相图,通过对相图的分析研究了体系的相容性;讨论了胶液的均一性、借助凝胶时间的测定研究了固化剂双氰胺以及促进剂2-乙基-4-甲基咪唑对体系反应性的影响;分析讨论了含胶量对体系电性能、机械性能以及耐水性的影响,确定了合理的制作半固化片的工艺。通过研究认为,聚苯醚/溴化环氧树脂体系表现最高临界相容温度行为,同时当聚苯醚含量为60%～70%时体系的浊点曲线与玻璃化转变温度曲线相交;聚苯醚/溴化环氧树脂体系在甲苯-二氯甲烷的混合溶剂中的均一性良好,得到的层压板的性能较优,比传统的FR-4型覆铜板的性能尤其是电性能、耐热性、弯曲强度以及耐水性提高幅度较大。Bromize epoxy (BEP), which is always used as the resin matrix of copper clad laminate (CCL), has faced the challenge to prepare the high performance CCL for the deficiencies such as notenough thermal resistance, poorer dielectric properties at higher frequencies, inferior size stability at higher temperatures and lower toughness and so on. The authors prepared highperformance CCL by introducing poly (2,6dimethyl1, 4phenylene ether)(PPO or PPE) as the modification resin to solve the problem mentioned above. For solutions of PPO and BEP, the upper critical solution temperature (UCST) cloud point curves intersect the glass transitioncomposition lines at a PPO content of 60 wt%~70 wt%. Cure behavior and miscibility have been studied in blends of PPO with BEP and dicyandiamide (DICY) hardener, EMI2, 4imidazole as accelerator by gel tests and FTIR. The reasonable process of halfcuring are settled down by considering the influence of the process on the properties of the halfcured sheet and CCL. The results show that PPO/BEP form a uniform system or glue with some certain solvents; the properties of the CCL prepared using the PPO/BEP are much better than those of the conventional CCL (FR4), especially the dielectric properties, thermal stability, flexural strength and water resistance.

关 键 词：聚苯醚改性环氧树脂基覆铜板 电性能 耐热性 弯曲强度 耐水性 印制电路板 

分 类 号：TN4[电子电信—微电子学与固体电子学] TB333[一般工业技术—材料科学与工程]