Cu-P基非晶态钎料基础性研究  

Funjamental research for Cu-P ba■e■ amorphous filler alloys

作　　者：张邦维[1] 谭肇升[1] 张恒[1] 虞觉奇[1] 舒小林 

机构地区：[1]长沙湖南大学 [2]株洲通信元件厂

出　　处：《焊接学报》1992年第3期133-139,共7页Transactions of The China Welding Institution

摘　　要：研究了四元Cu87.6-x Ni8.3 Sn4.1Px钎料的非晶形成区,发现当x=11.9～16.5at%时,为非晶态合金。该非晶形成区比我们关于三元Cu90-x Nil0 Px钎料的研究结果要宽一些。还测定了四元CuNiSnP非晶态钎料的熔点、润湿性、钎焊接头机械强度、电阻以及显微组织随P含量的变化关系,发现随着P含量增加润湿性增加。而机械强度降低,讨论了其原因。综合所测定的性能指出,四元CuNiSnP非晶态钎料代替Ag-Cu基钎料的可行性。The amorphous formation range (AFR) of Cu87.6-xNi8.3S4.1Px alloy wastudied in this paper. It has been found that the alloy was amorphous when x=11.9 to 16.5at%,and its AFR was larger than that of Cu90-xNi10PT alloys. The dependences of melting point; wettability, mechanical and electrical properties, and microstructure on the phosphorus content were determined. The data have shown that the tensile strength increases and the wettability decreases as the phosphorus increases, of which the reasons were discussed. The determined data for the amorphous Cu-Ni-Sn-P alloys indicate that Ag-Cu based filler alloys could be replaced by the amorphous alloys.

关 键 词：非晶态 钎料 研究 Cu-P基 

分 类 号：TG425[金属学及工艺—焊接]