高频多层片式电感器用陶瓷材料的研究  

A Ceramic for the High Frequency Multilyaer Chip Inductor

作　　者：王少洪[1] 周和平[1] 乔梁[1] 

机构地区：[1]清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室,北京100084

出　　处：《机械工程材料》2003年第2期17-20,共4页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(69995523)

摘　　要：研究了CaO B2O3 SiO2体系微晶玻璃烧结工艺、烧结性能和微观结构等。结果表明,该体系陶瓷材料能够在低温850℃烧结,烧结性能良好;烧结体微观结构为大量尺寸和分布均匀的纳米晶粒、一定量残余玻璃相和少量气孔,烧结体的主晶相为CB(CaO·B2O3)、6C4S(6CaO·4SiO2)以及少量CS(CaO·SiO2)。该烧结体在高频下具有低介电常数(εr=5.058,1GHz)、低介电损耗(tgδ=0.0013,1GHz)。该材料能够在900℃和Au、Ag/Pd、Cu等电极材料共烧,是制造高频多层片式电感器的理想材料。Firing process, properties and microstructure of the CaOB2O3SiO2 system glass ceramic were investigated. Results showed that the glass ceramic of this system could be sintered at low temperature 850℃, which indicates that the material could be cofired with Au, Ag/Pd, Cu pastes at low temperature 900℃; The material has fine sintering properties, outstanding dielectric properties including low dielectric constant (about 5.0, 1GHz) and low dielectric loss (about 0.1%, 1GHz). The CaOB2O3SiO2 system glass ceramic is one of the perfect material for the High Frequency Multilayer Chip Inductor (HFMLCI).

关 键 词：高频式电感器 低介电低损耗 低温烧结 

分 类 号：TB321[一般工业技术—材料科学与工程]