金属盐比值对Fe-Ni-P-B合金化学镀层的影响  

Effects of metal salts ratio on Fe-Ni-P-B electroless plating alloy film

作　　者：黄维清 王玲玲[1] 黄桂芳[1] 李小凡[1] 王荣吉[1] 唐黎明[1] 

机构地区：[1]湖南大学应用物理系,湖南长沙410082

出　　处：《电镀与涂饰》2003年第2期4-7,共4页Electroplating & Finishing

摘　　要：　在铜基上化学镀Fe Ni P B四元合金,研究了FeSO4/(FeSO4+NiSO4)金属盐比值对沉积速率、镀层结构的影响,测试了镀层在不同介质中的电化学稳定性。结果表明,镀层沉积速率随FeSO4/(FeSO4+NiSO4)金属盐比值的增加先增后减,金属盐比值为0.5时,沉积速率达到极大值。镀层沉积速率影响镀层的结构,沉积速率增大,镀层出现非晶结构。镀层在不同介质溶液中的稳定性不同,在酸性介质中,由于镀层的溶解,电极电位向正方向移动;而在中性和碱性介质中,由于氧的扩散缓慢,体系的电极电位会随时间负移。FeNiPB quaternary alloy films were prepared on copper substrate by electroless plating. Effects of metal salts ratio of FeSO4/(FeSO4+NiSO4) on deposition rate, composition structure of the film were studied, and electrochemical stability of the film in different media solution was also tested. Results show that with the increase of metal salts ratio of FeSO4/(FeSO4+NiSO4), deposition rate increased initially, and reached the maximum value as the ratio was equal to 0.5, then decreased. Deposition rate affected structure of the film because the amorphous deposit structure was obtained at the high deposition rate. Stability of the deposit was dissimilar in different media solution. Potential of the deposit in acid solution shifted to positive direction due to dissolve of films, while potential in neutral or alkali solution shifted to negative direction due to slow diffusion of oxygen.

关 键 词：金属盐比值 Fe-Ni-P-B合金 化学镀层 金属盐 比值 

分 类 号：TQ153.2[化学工程—电化学工业]