微片混合电路计算机辅助设计  

HIMIC COMPUTER AIDED DESIGN

作　　者：周庆民[1] 

机构地区：[1]河南省科学院应用物理研究所,郑州450003

出　　处：《河南科学》1992年第1期78-82,共5页Henan Science

摘　　要：本文以印刷电路板布图软件为基础,结合表面组装电路特点,以电子调谐器电路为典型微片混合电路,实现了在面积为9.5×5cm^2的双层版面上计算机辅助布图设计。布通率为100％,组装密度达4只元器件/平方厘米,电路级间连线的寄生电容和寄生电感分别低达10^(-12)F和10^(-8)H量级。Based on the software used in PCB layout, a computer aided design system used in HIMIC design was established. By using of electronic tuner as the typical HIMIC, the computer aided design of the circuit limited on two-layer board be of 9.5 x 5cm^2 was realised. Routing completed ratio and pacaging density was as high as 100% and 4cm^(-2). The parasitic capacity and parasitic inductance of the circuit was as low as 10^(-12)F and 10^(-8)H.

关 键 词：微片混合电路 表面组装技术 布图 

分 类 号：TN710[电子电信—电路与系统]