电泳沉积法制备YBaCuO厚膜工艺的研究  

The Study on Preparing YBaCuO Thick Film with Electrophoretic Deposition Method

作　　者：李凤华[1] 赵升升[1] 王珏[1] 樊占国[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110004

出　　处：《低温与超导》2003年第2期26-28,32,共4页Cryogenics and Superconductivity

摘　　要：在极间距为 2 .5 cm的电泳容器中 ,以丙酮为分散介质 ,沉积速度随着粉末浓度和碘加入量的增加先增加后减小 ,最佳参数值 YBa Cu O粉末浓度 3g/ l,碘 0 .3/ l。在本实验设备条件下 ,外加直流电压应为 110 V。在 930℃下恒温 4小时就能达到固化效果 ,没有裂纹出现。固化膜对基带的附着力用划格法测量 ,按 ASTM( American Standards of Testing Mate-rial)标准可达 1级。The electrophoresis is proceeded in a vessel with a radius of 2.5cm. The depositing speed increased with the addition of powder and iodine at first, and then it reached the maximum when the powder concentration was 0.3g/l and the addition of iodine was 30mg/l. The applied electromotive force was determined as 110V in this work. The deposition time was about 5～10 minutes. The optimal sintering condition were 930℃ of temperature and 4 hours of sintering time. The adhesion of film to substrate reached 1 grade according to American Standard of Testing Materials.

关 键 词：电泳沉积法 YBaCuO厚膜 制备工艺 银基底 超导体材料 

分 类 号：TM26[一般工业技术—材料科学与工程]