Al/PI/SiO_2多层隔热膜制备与性能研究  

Study on Al/PI/SiO_2 Multilayer Insulation

作　　者：程银兵[1] 姚兰芳[1] 吴广明[1] 沈军[1] 马建华[1] 倪星元[1] 王珏[1] 

机构地区：[1]同济大学波耳固体物理研究所

出　　处：《材料科学与工程学报》2003年第2期221-223,共3页Journal of Materials Science and Engineering

基　　金：国家自然科学基金资助项目 (699780 1 7;5980 2 0 0 7) ;中国工程物理研究院军品配套项目

摘　　要：系统研究了Al/PI/SiO2 有机硅涂料多层隔热结构 (MLI)组成的隔热系统。分别研究了铝膜、作为支撑物的耐热聚酰亚胺塑料和低热导填充物三种材料 ,采用金属铝膜可以有效的阻挡高温红外热辐射 ,而气凝胶和有机硅树脂复合的隔热涂料是热导率很低的材料 ,对接触热传导具有很大的热阻。这种多层结构是一种性能优异的高温隔热体。Multilayer insulation (MLI) composed of Al film, polyimide and Organo silicone have been investigated. It is shown that Al film have low emissivity. Polyimide(PI) can be used under 500℃ for a short time. It is the suitable materials for our multi-layer insulation system as underlay which provide flexibility and mechanical intensity. The weightlessness is no more than 5% under 500℃ by TGA. Organosilicone been used as a part of thermal insulating coating. we mix silicone with pigment such as aerogel powder and other agent according to traditional paint process. The coating on PI plastic via rolling and brush show have good adhesion. we also analyze the reason. Finally, we measure the thermal insulation effect of the MLI system.

关 键 词：多层隔热膜 制备 性能 聚酰亚胺 有机硅树脂 溶胶凝胶法 气凝胶 有机硅涂料 铝膜 

分 类 号：TB383[一般工业技术—材料科学与工程] O484[理学—固体物理]