电沉积铜层的力学和电学性能的研究  

Electrodeposited Copper on Electricity and Mechanics Performance

作　　者：姜力强[1] 郑精武[1] 李华[1] 林旻[1] 

机构地区：[1]浙江工业大学材料科学研究所,浙江杭州310014

出　　处：《稀有金属》2003年第3期347-349,共3页Chinese Journal of Rare Metals

基　　金：国家科委地方重大科技攻关项目资助 (971110 0 3 9)

摘　　要：通过改变镀铜工艺中的阴极电流密度参数 ,测定了所获得镀铜层的硬度及电阻率。结果发现 ,镀铜层的硬度和电阻率开始都随阴极电流密度的增加而增加 ,当阴极电流密度大到一定程度时 ,它们的值又都达到平衡 ;而经过时效处理后 ,镀铜层的硬度和电阻率随时间的积累均呈减小的趋势 。The hardness and rate of resistance of copper electrodeposited were tested under various cathodic current densities. It is found that the hardness and rate of resistance increase with the growth of the cathodic current density . When the cathodic current density grow to some extent, they reach the balance. After the effects of time are applied, they decreas with time going by. And the more the cathodic current densities are, the more the ratio of the hardness and rate of resistant with the time are.

关 键 词：电沉积铜 硬度 电阻率 

分 类 号：TQ153[化学工程—电化学工业]