电脑箱勾板级进模废料上跳问题的分析与解决  

Analysis and Solution of Scraps-Bounce in Progressive Die Stamping for Computer Case Septum Board

作　　者：张宝忠[1] 

机构地区：[1]宁波职业技术学院,浙江宁波315800

出　　处：《模具工业》2003年第6期27-28,共2页Die & Mould Industry

摘　　要：介绍了电脑箱勾板的结构和冲压工艺 ,分析了该零件级进模冲压中产生废料上跳的原因 ,提出了防止废料上跳产生的综合措施 ,从根本上解决了电脑箱勾板级进模冲压时产生废料上跳的问题 ,提高了制件的质量和冲压生产效率。The die structure and the stamping process for computer case septum board were introˉduced.The reason of scraps-bounce in progressive die stamping was analyzed and the integrated measure was put forward to eradicate the phenomenon,enhancing the part quality and the producˉtivity.

关 键 词：勾板 级进模 冲压工艺 废料上跳 

分 类 号：TG386.3[金属学及工艺—金属压力加工]