Ni-P化学镀层在动态加载条件下的塑脆转变  

Ductile-Brittle Transition of Electroless Ni-P Plating under Dynamic Loading

作　　者：黄林国[1] 李曙[2] 李诗卓[2] 

机构地区：[1]台州职业技术学院九峰分院,浙江台州318020 [2]中国科学院金属研究所,辽宁沈阳110015

出　　处：《材料保护》2003年第6期22-24,共3页Materials Protection

基　　金：国家自然科学基金资助项目(59375204)

摘　　要：　利用单摆划痕法的动态加载特性,研究了Ni P化学镀层本身的塑脆转变。镀层的塑脆转变除可采用Lamy建议的塑脆转变深度D′判据外,还提出用新定义的临界法向力Fnc来表征。根据划痕深度d和法向力Fnc的大小,可把镀层在划痕过程中的力学行为分为塑性变形、塑脆转变和脆性断裂三个阶段。分析讨论了磷含量和热处理温度对塑脆转变的影响。Ductile\|brittle behaviors of electroless Ni\|P plating had been studied using a single\|pass pendulum scratching tester with dynamic loading. Except Lamy's suggestion of ductile\|brittle transition depth D', as\|defined critical normal force Fnc could be supposed as a new ductile\|brittle transition criterion for Ni\|P plating. According to the magnitudes of scratching depth d and normal force Fnc, the mechanical behaviors of deposits during grooving could be divided into three steps: ductile deformation, ductile\|brittle transition and brittle fracture. Influences of phosphorus content and heat\|treatment on ductile\|brittle transition were discussed.

关 键 词：Ni—P化学镀层 塑脆转变 动态加载 

分 类 号：TQ153[化学工程—电化学工业]