PCB的化学镀锡应用技术  

Application Technique of Electroless Tin in PCB

作　　者：张志祥 

机构地区：[1]深圳益源丰电子材料有限公司,518000

出　　处：《印制电路信息》2003年第4期49-52,55,共5页Printed Circuit Information

摘　　要：本文阐述PCB的绿色表面涂覆的化学镀锡工艺的有关理论和技术,化学镀锡应用是实现取代热风整平表面涂覆绿色化的最重要的手段之一,化学镀锡应用也是实现取代内层板棕化和黑化表面涂覆的产品换代升级已成必然之势。The thesis describe theories and technology process of Electroless Tin for environmental equipment on surfaces coating in PCB,it is important means that Application technique of electroless Tin is going to replace Hot Air Solder levelling for environmental equipment on surfaces coating,it has becomed Inevitable trend which change the on behalf on product grade the ueep that Application technique of Electroless Tin is going to replace Brown Oxide&Black Oxiode of inner layer for environmental equipment on surfaces coating.

关 键 词：印刷电路板 PCB 化学镀锡 表面涂覆 内层板棕化 生产线工艺流程 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN405