力电耦合载荷作用下铁电陶瓷破坏行为的云纹干涉方法研究  被引量:3

Study on the Fracture Behavor of Ferroelectric Ceramics under Combined Electrical and Mechanical Load by Using a Moire Interferometry Technique

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作  者:方岱宁[1] 刘战伟[1] 谢惠民[1] 李尚[1] 戴福隆[1] 邴歧大[1] 

机构地区:[1]清华大学工程力学系,北京100084

出  处:《实验力学》2003年第2期156-160,共5页Journal of Experimental Mechanics

摘  要:本文介绍了如何用云纹干涉法实时地观察铁电陶瓷在力载荷和电载荷共同作用下裂尖的破坏行为.测量了三点弯试验中由电场和应力集中导致的裂尖的变形场.对变形的云纹图分析表明:当极化方向与裂纹扩展方向一致,且都与电场方向垂直,裂尖附近的正应变随电场的增加而增加,应变集中现象比较突出,电场促进和加速了裂纹的扩展.The fracture behavior around a crack tip in ferroelectric ceramics under combined electromechanical loading is observed by use of a moiré interferometry technique. The deformation field induced by the electric field and stress concentration near the crack tip in threepoints bending specimens were measured. By analyzing the moiré interferometry images, it is found that When the poling direction is parallel to the crack extension direction and perpendicular to the electric field, as the voltage of the electric field increases,strain near the crack tip raises, and strain concentration phenomena become more significant. So the electrical load may accelerate the crack extension.

关 键 词:力电耦合载荷 云纹干涉法 铁电陶瓷 三点弯试验 应力集中 裂尖 变形场 裂纹 破坏行为 

分 类 号:TM28[一般工业技术—材料科学与工程] TQ174.75[电气工程—电工理论与新技术]

 

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