薄板激光弯曲温度场的数值模拟与校验  

Simulation and Verification of the Temperature Field in Laser Bending Sheet Metal

作　　者：王秀凤[1] 吕晓东[1] 胡世光[1] 陈光南[2] 

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100083 [2]中国科学院力学所

出　　处：《北京航空航天大学学报》2003年第5期377-381,共5页Journal of Beijing University of Aeronautics and Astronautics

基　　金：国家自然科学基金资助项目 ( 5 983 62 2 0 );航空基础科学基金资助项目 ( 98H5 1110 )

摘　　要：采用MSC .Marc非线性有限元软件 ,对薄板激光弯曲过程中的温度场进行了数值模拟 ,得到了引起薄板激光弯曲变形的温度场的变化规律 .通过温度传感器测量与激光扫描线相对应的薄板下表面温度变化的规律来验证数值模拟的结果 .模拟值与实测值基本吻合 ,表明数值模拟结果可作为激光加工工艺参数选择的依据 .Temperature field in the laser bending process was numerically simulated by MSC. Marc software. Variations of temperature with time to cause sheet metal bending were calculated. Simulation result was verified by the temperature on the lower surface of the sheet metal, which was measured by the thermocouple temperature transducer measuring under the laser scanning line. Experimental curves of temperature versus time are in agreement with simulation results. The simulation results can be regarded as a basis for choosing laser technological parameters.

关 键 词：薄板 激光弯曲 温度场 数值模拟 

分 类 号：TN249[电子电信—物理电子学] TG386.31[金属学及工艺—金属压力加工]