多层片式PTCR注浆成型工艺的研究  

Investigation into the slip casting technics of PTCR with multilayer chip

作　　者：陈艳 龚树萍 胡云香 周东祥[1] 

机构地区：[1]华中科技大学电子科学与技术系

出　　处：《华中科技大学学报（自然科学版）》2003年第7期22-24,共3页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家高技术研究发展计划资助项目 (2 0 0 1AA3 2 5 0 40 )

摘　　要：研究了BaTiO3基的片式PTCR陶瓷的注浆成型工艺 ,包括浆料的制备、粘合剂PVA用量及与粘度等之间的关系 ,采用PMAA NH4 为分散剂 ,加入适量PVA(质量分数wP 为 1%～ 2 % ,占粉料 )可获得固相质量分数w为 75 %～ 80 %的浆料 ,后烧成的瓷片与轧膜成型、Gelcasting(凝胶注膜 )成型方法获得的瓷片进行了主要性能比较 .同时采用注浆成型工艺成功制备出了多层PTCR热敏电阻器 .Slip casting process of PTCR ceramic based BaTiO 3 w as studied including the preparation of slurries, the optimal addition amount of P VA bonder. High solid loading with optimum amount of dispersing and binder agent s were obtained when dispersant is PMAA-NH 4 and the range of binder is 1?%～ 2?%. The sintered PTC chip by slip casting was compared with gel-casting and r oll forming in their main electrical properties. The multilayer chip PTCR by sli p casting with PTC effect was obtained.

关 键 词：片式PTCR 注浆成型 浆料 

分 类 号：TN605[电子电信—电路与系统]