射频激光对氧化铝陶瓷基片划片的研究  

Study on laser scribing of Al_2O_3 ceramic substrate with RF CO_2 laser

作　　者：侯廉平[1] 陈培峰[1] 陈清明[1] 

机构地区：[1]华中科技大学激光技术与工程研究院,武汉430074

出　　处：《激光技术》2003年第4期352-356,共5页Laser Technology

摘　　要：分析了RFCO2 激光陶瓷基板划片的机理及工艺参数选择的原则。通过数值模拟和实验 ,分析了脉冲频率、脉冲宽度、划片速度、辅助气压大小、离焦量等工艺参数对激光划片质量的影响。The mechanism of scribing ceramic substrate with RF CO 2 laser and fundamental choice law of technical parameters are analyzed.Through numerical simulation and experiment,the influences of factors such as frequency of pulse,pulse width,scribing speed,pressure of assistant air on the quality of laser scribing are investigated.

关 键 词：RF CO2激光器 划片 氧化铝陶瓷基片 数值模拟 

分 类 号：TN249[电子电信—物理电子学] TG665[金属学及工艺—金属切削加工及机床]