铜、钴在Pt(111)面上电结晶过程的现场ECSTM研究  

In Situ Observation of Copper and Cobalt Electrodeposition on Pt(111) by Using ECSTM

作　　者：曹为民[1] 印仁和[1] 严惠根[1] 胡滢[1] 

机构地区：[1]上海大学理学院,上海200436

出　　处：《上海大学学报（自然科学版）》2003年第4期303-306,共4页Journal of Shanghai University:Natural Science Edition

基　　金：国家自然科学基金 (2 0 2 71 0 3 2 );上海市教委青年基金 (0 2 AQ83 )资助项目

摘　　要：利用电化学扫描隧道显微镜(ECSTM)现场观察Co、Cu在铂单晶(111)面上的电结晶成膜过程.结果表明:Cu在铂单晶(111)面上的电结晶过程在欠电位下为层状平面生长,而本体沉积为三维岛状生长;Co在铂单晶(111)面上的电结晶过程无论是低过电位还是高过电位都呈三维岛状方式生长;Co、Cu电结晶过程均随过电位升高,成核数目增加.Copper and cobalt electrodeposition on Pt(111) was observed in situ by using an electrochemical scanning tunneling microscopy(ECSTM). In the experiment, the electrodeposition of Cu on Pt(111) exhibited layered growth at underpotential deposition, and three dimensional nucleation growth at overpotential deposition. The electrodeposition of Co on Pt(111) followed a three dimensional island growth mechanism at various deposition potentials. The crystal number of Cu and Co increased with overpotential.

关 键 词：电结晶 ECSTM 铜沉积层 钴沉积层 

分 类 号：TG115.21[金属学及工艺—物理冶金] TG[金属学及工艺—金属学] 146