集成电路芯片生产的职业病危害特点  

Characteristics of occupational disease hazards in the production of integrated circuit chips

作　　者：高金平[1] 吴世达[1] 胡天锡[1] 

机构地区：[1]上海市疾病预防控制中心,上海200336

出　　处：《中国卫生工程学》2003年第3期136-138,共3页Chinese Journal of Public Health Engineering

摘　　要：目的　研究集成电路芯片制造中作业人员的操作特点、接触职业病危害种类以及事故类型。方法　对集成电路芯片制造的生产流程、职业病危害及接触状况的资料进行收集整理。结果　根据生产流程中使用的设备及芯片制造所用原辅材料 ,论述了生产过程中各设备和操作工序涉及的各类高度、中度毒性化学物质、工艺特殊气体以及电离辐射和非电离辐射等职业病危害因素、作业人员操作特点和易发事故种类。结论　集成电路芯片制造中职业病危害问题值得关注。Object Describe the operating charaderistic of workers and sorts of exposing occupational disease hazards and types of unexpected accident in integrated circuit chips manufactung Methods Collect and settle the data for procedure and occupational disease hazards and exposure status in chips manufacturing Results Discuss a variety of high and medium toxicity chemical and special gas,as well as physical agents,operation characteristic of the workers and accident types which is based on manufacturing facility and raw materials.Conclusion Must pay attention to occupational disease hazards in the production of integrated circuit chips

关 键 词：集成电路 芯片生产 职业病 危害 种类 事故类型 

分 类 号：R135[医药卫生—劳动卫生]