环氧树脂体系固化反应及其复合材料介电性能  

Study on Curing Reaction of Epoxy Resins and Dielectric Property of their Composites

作　　者：陈平[1] 陈辉 蹇锡高[1] 高巨龙 张岩 

机构地区：[1]大连理工大学高分子材料系,大连116012 [2]国家树脂基复合材料工程技术研究中心,哈尔滨150036

出　　处：《高分子通报》2003年第4期1-9,共9页Polymer Bulletin

基　　金：国家"九五"重点科技攻关 ( 98 A2 8 0 117);国家"863"( 86341 0 7 5 );大连市优秀青年基金项目

摘　　要：环氧树脂是一类综合性能优异的热固性高分子材料 ,作为胶粘剂、复合材料用树脂基体、涂料等形式广泛应用于电子电气、机械制造、化工防腐、航空航天等众多领域中 ,成为各工业领域中不可缺少的基础材料。本文综述了本研究室在咪唑 环氧树脂体系 ,稀土有机化合物、叔胺羧酸复盐 酸酐 环氧树脂体系 ,氰酸酯 环氧树脂体系 ,硼胺络合物 环氧树脂体系的固化反应机理、固化反应动力学及其固化物结构与性能关系 ,纤维含量、排列方向、偶联剂种类等对玻璃纤维增强环氧树脂基复合材料及其界面介电性能的影响等 6个方面的研究进展。Epoxy resin and the glass fiber reinforced epoxy matrix composite with unique properties have been widely used in many filed.In this review article,the progress of curing mechanism,curing kinetic,and relation between the cured product structure and the properties of several latent epoxy cured system;Influence of content,orientation of fiber,and coupling agents on the dielectric properties of glass fiber reinforced epoxy matrix composite and interlayer studies was summarized.The highlights of the article are as follows:Curing mechanism,kinetic,reactivities of epoxy resins cured with 2\|ethyl\|4\|methylimidazole;curing and the properties of cured compound for rare\|earth organometallic compound([Mt(acac) n ,MrAn]),carboxylic acid double salt of tertiary amine(R 3N·HA)/Anhydride/epoxy resin system;co\|curing,product structure,and relation between structure and property of epoxy and cyanate resin system;Curing mechanism and kinetics of boron\|amine complex curable epoxy resin,influence of content and orientation of fiber electrical property of glass fiber reinforced epoxy matrix undirection composite, influence of coupling agents on dielectric property of glass fiberreinforced epoxy resin matrix composite and interlayer.

关 键 词：环氧树脂 固化反应 复合材料 介电性能 高分子材料 咪唑 酸酐 硼胺络合物 氰酸酯 

分 类 号：TQ323[化学工程—合成树脂塑料工业]