电子器件制造过程中的一种均匀化加热法的数值研究  

NUMERICAL STUDY ON A UNIFORM HEATING METHOD IN MANUFACTURE PROCESS OF ELECTRONIC PRODUCTS

作　　者：赵耀华[1] 刘志刚[1] 鹤田隆治[2] 

机构地区：[1]中国科学院工程热物理研究所,北京100080 [2]九州工业大学机械系

出　　处：《工程热物理学报》2003年第5期870-872,共3页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.59906006)

摘　　要：本文提出了喷嘴沿被加热物体宽度方向往复移动式射流冲击加热方法,该加热方法可提高被加热物体的等温性。通过进行数值模拟,得到了在任意时刻,被加热物体的温度分布及全体计算时间内被加热物体表面平均温度分布,进而得到了喷嘴移动周期与被加热物体的等温性的关系。A novel uniform heating method by impinging jet moving to-and-fro along the width of a heating object was proposed in this paper. By this method, isothermal characteristics of the heating object were promoted. A numerical simulation for this method was implemented to get the temperature distribution of the heating object and the average temperature distribution throughout the calculation time. Furthermore, the relation between the moving period of the nuzzle and the isothermal characteristics of the heating object was obtained.

关 键 词：射流冲击 均匀加热 微电子制造 

分 类 号：TK124[动力工程及工程热物理—工程热物理]