电子器件冷却用微型热管的蒸发传热分析  

Evaporation Analysis of Micro Heat Pipe for Cooling of Electronic Apparatus

作　　者：范春利[1] 曲伟[2] 杨立[1] 华顺芳[1] 马同泽[2] 

机构地区：[1]海军工程大学动力工程学院307教研室,湖北武汉430033 [2]中国科学院工程热物理研究所

出　　处：《电子器件》2003年第3期260-263,共4页Chinese Journal of Electron Devices

基　　金：国家自然科学基金重大资助项目(59995550-4)

摘　　要：通过对薄液膜蒸发传热以及热管壁轴向导热的分析,对三角形截面微型热管的蒸发段建立了蒸发传热模型。研究表明:薄液膜对热管蒸发传热的作用远远大于厚液膜;固液接触角在蒸发段沿轴向逐渐变小;对存在加工圆角的热管进行传热计算的时候,最小弯月面半径和加工圆角存在制约关系,不能简单的以加工圆角代替。The evaporation model of micro heat pipe with triangular cross section was presented by analyzing both the heat transfer through the thin liquid film and the heat conduction along the heat pipe wall. The conclusion can be reached, from the model, that most of heat is transferred from the thin liquid film while the heat transferred from the meniscus part is negligible and that the contact angle is become smaller and smaller along the evaporator section of the heat pipe. The minimum meniscus radius is conditional on the machining radius of the heat pipe wall and can not be considered simply as the machining radius.

关 键 词：徽型热管 薄液膜 蒸发传热分析 弯月面 电子器件 冷却 

分 类 号：TK124[动力工程及工程热物理—工程热物理] TN402[动力工程及工程热物理—热能工程]