六方BN微颗粒表面化学镀镍的动力学  

Kinetics of Chemically Plating Nickel on the Surface of Hexagonal Boron Nitride Micro-particles

作　　者：李钒[1] 赵晓峰[1] 张登君[1] 李报厚[1] 罗世民[1] 

机构地区：[1]中国科学院过程工程研究所,北京100080

出　　处：《过程工程学报》2003年第3期243-247,共5页The Chinese Journal of Process Engineering

摘　　要：研究了平均粒径为104 mm的BN颗粒表面以肼为还原剂的微镀镍过程中镍沉积量随时间的变化规律;分析了温度、添加剂等对沉积镍动力学规律的影响;不同沉积时刻取样观测表面沉积金属镍颗粒的SEM形貌,并进一步分析验证了动力学规律.The kinetic research for hydrazine reduction chemical plating of nickel on the surface of hexagonal boron nitride particles with the average diameter of 104 mm has been carried out in this work. Effects of reaction temperature and addition of surfactant SDS on nickel deposition were studied and discussed. SEM morphology observed and EDS analysis at different depositing time verified the kinetics of nickel deposition.

关 键 词：动力学 化学镀镍 氮化硼 微颗粒 表面形貌 

分 类 号：TQ153.12[化学工程—电化学工业]