温度循环对半导体集成电路气密性的影响  

Effects of Temperature Cycling on the Air-Tightness of Semiconductor IC's

作　　者：许斌[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2003年第5期425-427,共3页Microelectronics

摘　　要：　研究了温度循环对半导体集成电路气密性的影响,阐述了影响集成电路管壳气密性的各种因素;提出了一种摸底试验的方法;对5种集成电路管壳进行了温度循环试验,并对试验结果进行了分析。就试验的几种外壳来看,至少可以经受1000次温度循环,其气密性仍然满足要求。Effects of temperature cycling on the airtightness of semiconductor IC's are investigated in the paper Factors causing airtightness defects in IC's are described A method for simulation test is presented Temperature cycling tests are performed, and the results are analyzed It has been shown that, for the IC packages tested, the airtightness still meets the requirement after 1000 temperature cycles

关 键 词：温度循环 半导体集成电路 气密性 集成电路管壳 产品质量 

分 类 号：TN406[电子电信—微电子学与固体电子学]